General Design Guidelines

General Design Guidelines
Hybrid (Inches) Wafer (Micrometers)
Conductors Minimum Line Width / Minimum Space Width .0005 10
Line Width Tolerance .0002 Standard
.0001 Select
±3
Space Tolerance .0002 Standard
.0001 Select
±3
Minimum Pad Size Around Via (D = hole diameter) .006 + D ±10
Resistors Minimum Tolerance greater of 0.1%
or 0.1 Ω
.01%
Minimum Spacing Between Resistors .002 4
Minimum Length and / or Width .002 4
Pre Trim Designed Value –20% -20%
Nominal Sheet Resistance (ohms / ☐ )
Preferred Sheet Resistance (ohms / ☐ )
10 – 200
50 or 100
30-1500
(ohms / ☐ )
Terminations Minimum Pad Size (Wire Bond) .003 x .003 75 x 75
Metalized Holes
(VIA's)
Minimum Aspect Ratio
(Hole diameter: Substrate thickness)
0.6:1 N/A
Minimum Tolerance .002
Minimum Distance from Hole Circumference To Edge
(T = substrate thickness) or adjacent hole circumference
T
Minimum True Center Tolerance .001
Substrates Minimum Thickness Tolerance .0005 10
Minimum Length / Width Tolerance .001 N/A
Surface Finish
(Microinch – CLA not available in all materials)
.2 – 10 .001
Minimum Camber (Polished only)
Typical Camber – Polished
Typical Camber – As Fired
.0002 / inch
.0005 / inch
.002 / inch
10 across 150
millimeters
Data Format DXF, DWG, GDSII, Gerber (Consult Factory For Other Formats) All formats DXF, GDS II
Closed Polylines (0 Width) Traces
Minimum Resistor On Conductor Overlap .002 10
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