Inductors

Typical values range from 0.1 - 45 nH. The coil material consists of patterned plated copper or gold on a sputtered seed layer. The preferred substrates for hybrid assembly construction are supplied either polished or as-fired. Typical dimensions for hybrid substrate designs (in micrometers) are: 25 μm wide, 20 μm spacing at < 5 μm thick. 50 μm wide, 46 μm spacing at < 10 μm. thick, 125 μm wide, 100 μm spacing, 12.5 – 75 μm thick. See design summary below:

Inductors
Construction Platform Width (μm) Spacing (μm) Height (μm)
Hybrid 25 20 5
50 46 > 10
125 100 75
Wafer > 10 > 10 Max 20*
*BCB Dielectric Separator layers 5-10 μm
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