Typical Metalizations

Typical Metalizations
Typical Hybrid
Metalizations
Application Attachment
Method
Metalization/
Resistor Layers
Typical
Value
1. TaN - TiW - Ni* RF/Microwave circuits: attenuators, loads and DC biasing networks. Hybrids with resistors and spiral inductors.

End products: Power supplies, couplers, splitters, filters, amplifiers, SAW devices, laser diode mounts and others.
Pb/In, Au/Sn,
Au/Ge - Eutectic

Epoxy

Wire Bonding
TaN   10 to 200 ohms/sq.
TiW   300 to 1000 Å
NiV   1000 to 2000 Å
Au     20 to 300 μin
50
500
1500
150
2. TiW - Ni* - Au Same as 1. - without resistors Pb/In, Au/Sn,
Au/Ge - Eutectic

Epoxy

Wire Bonding
TiW   300 to 1000 Å
NiV   1000 to 2000 Å
Au     20 to 300 μin
500
1500
150
3. TaN - TiW - Au - Ni - Au Same as 1. - When repeated soldering is required for repairs Pb/Sn, Au/Sn
soldering

Epoxy

Wire Bonding
TaN   10 to 200 ohms/sq.
TiW   300 to 1000 Å
Au     20 to 300 μin
Ni      50 to 150 μin
Au     20 to 200 μin
50
500
20 min.
50 min.
150
4. TiW - Cu - Ni* - Au High Power/Low Loss RF and Power Supply Pb/Sn,
Au/Sn soldering

Epoxy

Wire Bonding
TiW   300 to 1000 Å
Cu     200 to 2000 μin
Ni      50 to 150 μin
Au     20 to 200 μin
500
500
50 min.
150 min.
5. TiW - Au - Cu - Ni* - Au High Power/Low Loss RF and Power Supply Pb/Sn, Au/Sn
soldering

Epoxy

Wire Bonding
TiW   300 to 1000 Å
Au     3000 to 5000 Å
Cu     200 to 2000 μin
Ni      50 to 150 μin
Au     20 to 200 μin
500
3000 min.
500
50 min.
150 min.
6. TaN - TiW - Au Cu - Ni* - Au High Power/Low Loss RF and Power Supply with Resistors Pb/Sn, Au/Sn
soldering

Epoxy

Wire Bonding
TaN   10 to 200 ohms/sq.
TiW   300 to 1000 Å
Au     3000 to 5000 Å
Cu     200 to 2000 μin
Ni      50 to 150 μin
Au     20 to 200 μin
50
500
3000 min.
500
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