| Custom Thin Film Circuits and Components
ATC brings a new standard of responsiveness and quality to thin film technology. Custom metalization and patterned substrates are offered to address a broad spectrum of deposition and hybrid circuit fabrication requirements Custom metallization consists of sputtered and electroplated coatings made to specifications. Products may include via holes and odd shaped substrates in a wide choice of ceramics and dielectric materials. Three target, batch sputtering systems with load-locks are utilized for producing the most consistent film quality.
 Metalization Schemes
Design Guidelines
Substrate Properties
Special Features
Etched or pattern-plated substrates are made to specifications. Designs may include metallized via holes, crossovers and air bridges.
ATC's experienced engineering staff is avilable to provide assistance in choosing the proper substrates and metallization systems at the inception of a project. They will also assist in troubleshooting a customer's process if difficulties are encountered.
The traditional ATC Quality Assurance Program is now certified to ISO 9002 and will meet most existing military and aerospace requirements. MIL-STD-883 is used as a guide for 100% visual inspection in our in-process procedures. MIL-STD-105D Level II sampling is used for final QA Inspections.
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